Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/182094
Kind Code:
A1
Abstract:
The present invention provides an active-ray-sensitive or radiation-sensitive resin composition which makes it possible to achieve excellent pattern transferability when a resist pattern is formed therefrom and an object of interest is etched using the resist pattern as an etching mask to form a pattern, so that a pattern formed by etching the object can have excellent LWR performance. The active-ray-sensitive or radiation-sensitive resin composition according to the present invention contains a resin which contains a repeating unit represented by formula (I) and a repeating unit represented by formula (II) and has a main chain capable of being cleaved by exposure to light and a compound which has at least two ion pairs capable of being decomposed by exposure to light, in which the weight average molecular weight of the resin is 15000 or more.
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Inventors:
SHIRAKAWA MICHIHIRO (JP)
TAKAHASHI SATOMI (JP)
TAKAHASHI SATOMI (JP)
Application Number:
PCT/JP2023/010043
Publication Date:
September 28, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F212/14; C08F220/22; C08F220/54; G03F7/20
Domestic Patent References:
| WO2021153466A1 | 2021-08-05 | |||
| WO2019045107A1 | 2019-03-07 | |||
| WO2020013111A1 | 2020-01-16 | |||
| WO2020040034A1 | 2020-02-27 | |||
| WO2023286763A1 | 2023-01-19 | |||
| WO2023286736A1 | 2023-01-19 | |||
| WO2023286764A1 | 2023-01-19 |
Foreign References:
| JP2013228681A | 2013-11-07 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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