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Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/218970
Kind Code:
A1
Abstract:
Provided are, inter alia, an active-ray-sensitive or radiation-sensitive resin composition containing a resin that increases in polarity under the action of acid and a compound having a specified structure, an active-ray-sensitive or radiation-sensitive film that uses said composition, a pattern formation method, a method for manufacturing an electronic device, and an active-ray-sensitive or radiation-sensitive resin composition that has excellent sensitivity and resolution in ultra-fine pattern formation due to a compound having a specified structure.

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Inventors:
MIYOSHI TARO (JP)
YAMAGUCHI SHUHEI (JP)
MOTOYAMA HIROKI (JP)
Application Number:
PCT/JP2023/016520
Publication Date:
November 16, 2023
Filing Date:
April 26, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C25/18; C07C39/27; C07C39/38; C07C39/40; C07C47/565; C07C49/825; C07C69/88; C07C205/22; C07C255/53; C07C317/22; C07C381/12; C08F12/04; G03F7/038; G03F7/039; G03F7/20
Foreign References:
JP2002082431A2002-03-22
US4924009A1990-05-08
JP2016006495A2016-01-14
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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