Title:
ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/129626
Kind Code:
A1
Abstract:
An adhesion removal method which, without disassembly of a chamber, can remove sulfur-containing adhesions adhering to the inner surface of the chamber or the inner surface of a pipe connected to the chamber, and a film forming method are provided. Sulfur-containing adhesions adhering to the inner surface of a chamber (10) and/or the inner surface of a discharge pipe (15) connected to the chamber (10) are removed by reaction with a cleaning gas that contains a hydrogen-containing compound gas.
Inventors:
TANIMOTO YOSUKE (JP)
OSADA SHIMON (JP)
OSADA SHIMON (JP)
Application Number:
PCT/JP2019/047269
Publication Date:
June 25, 2020
Filing Date:
December 03, 2019
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
H01L21/205; C23C16/44; H01L21/31
Foreign References:
| JP2009503882A | 2009-01-29 | |||
| JP2003273082A | 2003-09-26 | |||
| JP2012039084A | 2012-02-23 | |||
| JP2018188339A | 2018-11-29 | |||
| JP2009037821A | 2009-02-19 | |||
| JPS6164317A | 1986-04-02 |
Other References:
See also references of EP 3901989A4
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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