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Title:
ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM FOR CIRCUIT CONNECTION, AND MANUFACTURING METHOD FOR CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/136274
Kind Code:
A1
Abstract:
Provided is an adhesive agent composition containing (A) an epoxy resin and (B) a curing agent, wherein, for the (A) ingredient, a xylene-novolac based glycidyl ether is included. Further provided is an adhesive agent film for circuit connection having a region formed from the adhesive agent composition. Still further provided is a connection structure comprising a first circuit member that has a first electrode, a second circuit member that has a second electrode, and a connection part that is disposed between the first circuit member and the second circuit member and that electrically connects the first electrode and the second electrode to each other, wherein the connection part includes a cured product of the adhesive agent film for circuit connection.

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Inventors:
KOBAYASHI RYOHTA (JP)
TOMISAKA KATSUHIKO (JP)
MORIYA TOSHIMITSU (JP)
MIYAJI MASAYUKI (JP)
YAMAZAKI YUTA (JP)
Application Number:
PCT/JP2023/000534
Publication Date:
July 20, 2023
Filing Date:
January 12, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09J163/00; C09J7/30; C09J9/02; C09J11/06; H01B1/20; H05K1/03
Domestic Patent References:
WO2022220285A12022-10-20
WO2022124336A12022-06-16
Foreign References:
JP2014036172A2014-02-24
JP2021138795A2021-09-16
JP6950844B12021-10-13
JP2017214472A2017-12-07
Other References:
KWON WOON-SEONG, PAIK KYUNG-WOOK: "Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs", JOURNAL OF APPLIED POLYMER SCIENCE, JOHN WILEY & SONS, INC., US, vol. 93, no. 6, 15 September 2004 (2004-09-15), US , pages 2634 - 2641, XP093079646, ISSN: 0021-8995, DOI: 10.1002/app.20844
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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