Title:
ADHESIVE COMPOSITION, ADHESIVE FILM AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/117604
Kind Code:
A1
Abstract:
Provided is an adhesive composition capable of limiting reduction in adhesiveness even after preservation in room temperature or refrigeration environment, the adhesive composition providing excellent adhesiveness under the same adhesion conditions as in the state of the art. The present invention provides an adhesive composition including: a binder composition containing a cationic polymerizing component and a component for forming a film; and a cationic polymerization initiator. The cationic polymerization initiator is a quaternary ammonium salt-based thermal acid generator, and the cationic polymerizing component contains a bifunctional alicyclic epoxy compound and a tetrafunctional alicyclic epoxy compound.
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Inventors:
KITADUME KOJI (JP)
FUKAYA TATSUROU (JP)
FUKAYA TATSUROU (JP)
Application Number:
PCT/JP2020/045072
Publication Date:
June 17, 2021
Filing Date:
December 03, 2020
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C08G59/32; C09J7/32; C09J7/35; C09J9/02; C09J11/06; C09J163/00; C09J171/12; C09J183/04; H01B1/20
Domestic Patent References:
| WO2019159566A1 | 2019-08-22 |
Foreign References:
| JP2016204454A | 2016-12-08 | |||
| JP2018090705A | 2018-06-14 | |||
| JP2017152354A | 2017-08-31 | |||
| JP2016172813A | 2016-09-29 | |||
| JP2017214472A | 2017-12-07 | |||
| JP2019156964A | 2019-09-19 | |||
| JP2019106305A | 2019-06-27 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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