Title:
ADHESIVE COMPOSITION AND LAMINATE WITH ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2023/127890
Kind Code:
A1
Abstract:
Provided is an epoxy-based adhesive composition excelling in re-dispersibility of a filler, having a re-peelable property in a B-stage state, and capable of forming an adhesive layer exhibiting excellent adhesive strength after a curing reaction. Also provided is a laminate with an adhesive layer in which the adhesive composition is used.
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Inventors:
KITA SHINJI (JP)
OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
KONDO TAKAHIRO (JP)
OKIMURA YUYA (JP)
HIRAKAWA MAKOTO (JP)
KONDO TAKAHIRO (JP)
Application Number:
PCT/JP2022/048252
Publication Date:
July 06, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
B32B27/00; C09J7/35; C09J11/08; C09J123/10; C09J123/26; C09J125/08; C09J151/00; C09J163/00
Domestic Patent References:
| WO2016047289A1 | 2016-03-31 | |||
| WO2017150336A1 | 2017-09-08 | |||
| WO2021033578A1 | 2021-02-25 | |||
| WO2018030026A1 | 2018-02-15 |
Foreign References:
| JP6981583B1 | 2021-12-15 | |||
| JP2021138944A | 2021-09-16 | |||
| JP2006036868A | 2006-02-09 | |||
| JP7120497B1 | 2022-08-17 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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