Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/068558
Kind Code:
A1
Abstract:
Provided is an adhesive composition endowed with cutting processability when processed to match the shape of the adherend prior to bonding, long-term storage stability at normal temperatures before bonding of the cut shape after processing, low-temperature meltability that does not harm the adherend during bonding, and level difference-absorbing ability after bonding. The present invention proposes for this purpose an adhesive composition characterized by containing 1-50 parts by weight of a crosslinking agent and 0.3-3 parts by weight of a photopolymerization initiator per 100 parts by weight of an ethylene-α-olefin copolymer, and having a crystal melting peak by DSC of 30-80°C.
Inventors:
INENAGA MAKOTO (JP)
FUKUDA SHINYA (JP)
FUKUDA SHINYA (JP)
Application Number:
PCT/JP2014/077820
Publication Date:
May 14, 2015
Filing Date:
October 20, 2014
Export Citation:
Assignee:
MITSUBISHI PLASTICS INC (JP)
International Classes:
C09J123/08; C09J7/02; C09J11/06
Domestic Patent References:
| WO2013105616A1 | 2013-07-18 | |||
| WO2010038366A1 | 2010-04-08 | |||
| WO2011129200A1 | 2011-10-20 | |||
| WO2010027041A1 | 2010-03-11 | |||
| WO2010044229A1 | 2010-04-22 | |||
| WO2011129200A1 | 2011-10-20 | |||
| WO2010038366A1 | 2010-04-08 |
Foreign References:
| JP2011012246A | 2011-01-20 | |||
| JP2012009754A | 2012-01-12 | |||
| JP2011012246A | 2011-01-20 | |||
| JP2012009754A | 2012-01-12 |
Other References:
See also references of EP 3067400A4
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
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