Title:
ASIC CHIP AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/006998
Kind Code:
A1
Abstract:
An ASIC chip (100a, 100b, 100c), comprising: a substrate (10a, 10b, 10c), said substrate (10a, 10b, 10c) comprising a top surface (11a, 11b, 11c). The ASIC chip (100a, 100b, 100c) also comprises a metal pad (20a, 20b, 20c) fixed on the top surface (11a, 11b, 11c), and a first thin film (30) deposited on the top surface (11a, 11b, 11c) and covering the top surface (11a, 11b, 11c). A through hole (31) running through the first thin film (30) is formed on the first thin film (30) at a position corresponding to the metal pad (20a, 20b, 20c), and the metal pad (20a, 20b, 20c) is accommodated in the through hole (31). The top surface (11a, 11b, 11c) comprises edge portions (111a, 111b, 111c) arranged opposite to each other, and corner portions (112a, 112b, 112c) that are connected to adjacent edge portions (111a, 111b, 111c). A first area (32) is formed by means of etching the corner portions (112a, 112b, 112c) of the first thin film (30), a second area (33) is formed by means of etching the center (113a, 113b, 113c) of the top surface (11a, 11b, 11c) of the first thin film (30), and a flow guide groove (34) communicating the first area (32) and the second area (33) is formed by means of further etching the first thin film (30). Thus, a height difference is formed between the substrate center (113a, 113b, 113c), the corner portions (112a, 112b, 112c), and other areas, so that an adhesive layer (50b, 50c) can be guided to cover the ASIC chip (100a, 100b, 100c) after one adhesive dispensing, thereby reducing the risk of adhesive overflow due to multiple adhesive dispensations.
Inventors:
BAI YANG (CN)
TU LANLAN (CN)
TU LANLAN (CN)
Application Number:
PCT/CN2020/103704
Publication Date:
January 13, 2022
Filing Date:
July 23, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H01L23/31; B81B7/00; B81B7/02; B81C1/00; H01L21/56; H04R19/00
Foreign References:
| CN206940424U | 2018-01-30 | |||
| CN205071304U | 2016-03-02 | |||
| CN103367287A | 2013-10-23 | |||
| CN1808713A | 2006-07-26 | |||
| CN103347239A | 2013-10-09 | |||
| CN106793723A | 2017-05-31 | |||
| CN205122575U | 2016-03-30 | |||
| CN210607238U | 2020-05-22 | |||
| US20140225284A1 | 2014-08-14 |
Attorney, Agent or Firm:
SHENZHEN HUASHENG ZHIHUI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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