Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2022/006999
Kind Code:
A1
Abstract:
Provided is a MEMS microphone, comprising a base having a back cavity, a diaphragm arranged separate from the base with a gap therebetween, and a back panel covering the diaphragm and arranged separate from the diaphragm with an inner cavity therebetween. The back panel comprises a fixing portion and a main body portion surrounding and connected to the fixing portion, the central area of the main body portion forming a protruding portion protruding in the direction away from the diaphragm. The presence of the protruding portion increases the distance between the main body portion and the diaphragm, such that after an acoustic wave airflow passes through an acoustic hole and enters the inner cavity, the flow rate of the acoustic wave airflow in the inner cavity corresponding to the protruding portion is smaller than the average airflow rate in the inner cavity, thereby lowering the pressure film damping and reducing the mechanical noise of the MEMS microphone.

Inventors:
ZHAO ZHUANZHUAN (CN)
BAI YANG (CN)
DAN QIANG (CN)
WANG KAIJIE (CN)
LI YANG (CN)
ZHANG RUI (CN)
Application Number:
PCT/CN2020/103723
Publication Date:
January 13, 2022
Filing Date:
July 23, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECH NANJING CO LTD (CN)
International Classes:
H04R19/04; H04R1/22; H04R1/28
Foreign References:
CN206932407U2018-01-26
CN110574396A2019-12-13
CN103067833A2013-04-24
US20130062710A12013-03-14
Attorney, Agent or Firm:
SHENZHEN HUASHENG ZHIHUI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
Download PDF:



 
Previous Patent: ASIC CHIP AND MANUFACTURING METHOD

Next Patent: MEMS MICROPHONE