Title:
BONDING WIRE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/205532
Kind Code:
A1
Abstract:
A bonding wire (1) is configured from: a hollow member (2) formed from an insulator provided across ICs (10-1, 10-2) on which wirings (11-1, 11-2) of an object to be connected are formed so that a plurality of opening end surfaces (20-1, 20-2) are closed off by coming into contact with the surface of wirings (11-1, 11-2); and a connecting member 3 formed from a conductor with which the hollow member (2) is filled so that the conductor joins the surface of the wirings (11-1, 11-2) at the locations where the hollow member (2) comes into contact with the surface of the wirings (11-1, 11-2).
Inventors:
KISHI TOSHIKI (JP)
SHIKAMA KOTA (JP)
SHIKAMA KOTA (JP)
Application Number:
PCT/JP2020/015637
Publication Date:
October 14, 2021
Filing Date:
April 07, 2020
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01L21/60
Foreign References:
| JP2012231034A | 2012-11-22 | |||
| JP2016195292A | 2016-11-17 | |||
| JP2019134181A | 2019-08-08 |
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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