Title:
CARRIER FOIL-ATTACHED ELECTROLYTIC COPPER FOIL PROVIUDED WITH INSULATION LAYER FORMING RESIN LAYER, COPPER-CLAD LAMINATED SHEET, PRINTED CIRCUIT BOARD, PRODUCTION METHOD FOR MULTILAYER COPPER-CLAD LAMINATED SHEET AND PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2005/087489
Kind Code:
A1
Abstract:
A technique of using a copper foil not roughened as a printed circuit board, especially a method using a carrier foil-attached electrolytic copper foil. A carrier foil-attached electrolytic copper foil or the like is used, which is provided with an insulation layer forming resin layer, and which is characterized by being provided on the surface of a carrier foil with a joint interface layer, on the joint interface layer with an electrolytic copper foil layer smooth on the both surfaces thereof, and on the electrolytic copper foil with a resin layer. Resin compositions constituting this resin layer include 20-80 pts.wt. of epoxy resin (including a curing agent), 20-80 pts.wt. of aromatic polyamide resin polymer soluble in a solvent, and a curing accelerator added in a proper amount as needed.
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Inventors:
NAGATANI SEIJI (JP)
Application Number:
PCT/JP2005/004501
Publication Date:
September 22, 2005
Filing Date:
March 15, 2005
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
NAGATANI SEIJI (JP)
NAGATANI SEIJI (JP)
International Classes:
B32B15/08; B32B15/088; B32B15/092; H05K1/03; H05K3/00; H05K1/09; H05K3/02; H05K3/46; H05K3/42; (IPC1-7): B32B15/08; H05K1/03; H05K1/09; H05K3/00; H05K3/46
Domestic Patent References:
| WO2002024444A1 | 2002-03-28 |
Foreign References:
| JP2000043188A | 2000-02-15 | |||
| JPH08503174A | 1996-04-09 | |||
| JP2003292733A | 2003-10-15 | |||
| JP2002033581A | 2002-01-31 | |||
| JPH0918140A | 1997-01-17 |
Attorney, Agent or Firm:
Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, JP)
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