Title:
CHIP AS WELL AS MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/045730
Kind Code:
A1
Abstract:
A chip as well as a manufacturing method therefor, and an electronic device. The chip comprises a first device block (21) and a second device block (22) arranged side by side on a substrate (1), and N wiring layers covering the first device block (21) and the second device block (22). The first device block (21) is located in a first reticle field (D1), and the second device block (22) is located in a second reticle field (D2), a first gap (S1) being provided between the first device block (21) and the second device block (22). Each wiring layer comprises a first signal transmission part (31) located above the first device block (21) and a second signal transmission part (32) located above the second device block (22). Each of at least two wiring layers comprises a first interconnection part (33) located above the first gap (S1), that is, not only the top layer is provided with a first interconnection part (33), but also a wiring layer, such as the secondary top layer, is provided with a first interconnection part (33), so as to improve the wiring density of the first interconnection parts (33).
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Inventors:
WANG ZHONGTAO (CN)
CHEN ZANFENG (CN)
XU RUN (CN)
ZENG QIULING (CN)
CHEN ZANFENG (CN)
XU RUN (CN)
ZENG QIULING (CN)
Application Number:
PCT/CN2023/097778
Publication Date:
March 07, 2024
Filing Date:
June 01, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/528
Foreign References:
| CN113539845A | 2021-10-22 | |||
| CN113517205A | 2021-10-19 | |||
| CN108305851A | 2018-07-20 | |||
| US20180096952A1 | 2018-04-05 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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