Title:
THREE-DIMENSIONAL PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/045731
Kind Code:
A1
Abstract:
A three-dimensional packaging structure (10) and a manufacturing method therefor. The three-dimensional packaging structure (10) comprises: a packaging substrate (500), a rewiring layer (100), a plurality of TSV bridging substrates (200), a plurality of chips (400), and a plastic packaging material layer (300). The rewiring layer (100) is located on the upper surface of the packaging substrate (500) and is connected to the packaging substrate (500) by means of bonding; the plurality of TSV bridging substrates (200) are located on the upper surface of the rewiring layer (100) and are connected to the rewiring layer (100) by means of bonding; the plurality of chips (400) are located on the upper surface of the plurality of TSV bridging substrates (200) and are connected to the plurality of TSV bridging substrates (200) by means of bonding; the plastic packaging material layer (300) is formed on the upper surface of the rewiring layer (100). The present invention can solve the problems in existing packaging technologies of increased costs and low yields due to the fact that heterogeneous chips are interconnected by using whole TSV interposer substrates and the TSV interposer substrates are directly electrically connected to packaging substrates.
Inventors:
CHEN YENHENG (CN)
LIN CHENGCHUNG (CN)
LIN CHENGCHUNG (CN)
Application Number:
PCT/CN2023/097801
Publication Date:
March 07, 2024
Filing Date:
June 01, 2023
Export Citation:
Assignee:
SJ SEMICONDUCTOR JIANGYIN CORP (CN)
International Classes:
H01L21/50
Foreign References:
| CN115132593A | 2022-09-30 | |||
| CN110854093A | 2020-02-28 | |||
| CN107611045A | 2018-01-19 | |||
| US20200343184A1 | 2020-10-29 | |||
| US20210193577A1 | 2021-06-24 |
Attorney, Agent or Firm:
J.Z.M.C. PATENT AND TRADEMARK LAW OFFICE (GENERAL PARTNERSHIP) (CN)
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