Title:
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/040569
Kind Code:
A1
Abstract:
Embodiments of the present application provide a circuit board assembly and an electronic device. The circuit board assembly is used for an electronic device. The circuit board assembly at least comprises a first circuit board, a frame plate, and a second circuit board. The frame plate is provided on one side of the first circuit board. The frame plate comprises a frame body and a connecting structure member. The frame plate comprises an avoidance space disposed corresponding to the connecting structure member. The connecting structure member is used for connecting the frame body. The frame body and the connecting structure member are both connected to the first circuit board. The second circuit board is provided on the side of the frame plate facing away from the first circuit board. The frame body and the connecting structure member are both connected to the second circuit board, such that the first circuit board and the second circuit board are connected by means of the frame body and the connecting structure member. The circuit board assembly provided by the embodiments of the present application can increase the overall utilization rate of the circuit board.
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Inventors:
GUO JIANQIANG (CN)
LUO WENJUN (CN)
YANG FAN (CN)
LUO WENJUN (CN)
YANG FAN (CN)
Application Number:
PCT/CN2022/113324
Publication Date:
March 23, 2023
Filing Date:
August 18, 2022
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H05K3/36; H05K1/14; H05K7/14
Domestic Patent References:
| WO2019235877A1 | 2019-12-12 |
Foreign References:
| CN209283623U | 2019-08-20 | |||
| CN213028710U | 2021-04-20 | |||
| US20120081864A1 | 2012-04-05 | |||
| CN110149762A | 2019-08-20 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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