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Title:
CIRCUIT BOARD MANUFACTURING METHOD CAPABLE OF SHIELDING ELECTROMAGNETIC INTERFERENCE
Document Type and Number:
WIPO Patent Application WO/2022/178650
Kind Code:
A1
Abstract:
The present invention relates to a circuit board manufacturing method capable of shielding electromagnetic interference, comprising the following steps: using a control processing apparatus to select a processing region from a circuit board that is provided with a plurality of electronic elements, calculating the positions of a plurality of via holes according to a region that is not provided with the plurality of electronic elements in the processing region, and filling a plurality of mark points in the plurality of via holes, wherein the interior of the circuit board comprises a copper foil layer capable of forming a contact surface; forming the plurality of mark points on the surface of the circuit board at a preset distance; spraying a liquid insulating material on the surface of the circuit board to form an insulating layer; cutting the circuit board outside the plurality of mark points; taking out the cut circuit board that comprises the plurality of mark points, so as to form exposed via holes; and spraying a liquid conductive material on the surface of the circuit board to form a conductive layer, and electrically connecting the conductive layer to the copper foil layer in the circuit board, so as to guide, by means of the conductive layer and the plurality of via holes, electromagnetic waves generated by starting the plurality of electronic elements to a grounding surface in the circuit board for elimination.

Inventors:
SU CHEN-WEI (CN)
Application Number:
PCT/CN2021/000031
Publication Date:
September 01, 2022
Filing Date:
February 25, 2021
Export Citation:
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Assignee:
SU CHEN WEI (CN)
International Classes:
H05K9/00; H01L23/552
Domestic Patent References:
WO2008062982A12008-05-29
WO2018168391A12018-09-20
Foreign References:
CN104105387A2014-10-15
CN107507823A2017-12-22
US20190371760A12019-12-05
Attorney, Agent or Firm:
KELONG INTERNATIONAL INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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