Title:
CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2024/034278
Kind Code:
A1
Abstract:
The present invention provides a circuit module wherein a lower circuit board overlaps with a part of an upper circuit board when viewed in the vertical direction. The upper circuit board, the lower circuit board and a sealing member form a main body part which has an upper surface, a lower surface and a lateral surface that connects the upper surface and the lower surface to each other. A shield member covers the upper surface and the lateral surface. When viewed in the vertical direction, a first component is positioned outside the outer periphery of the lower circuit board. The lower end of the first component is positioned below a second upper main surface. When viewed in the vertical direction, there is no component mounted on a first lower main surface or connection member mounted on the first lower main surface between the first component and a lateral surface that is closest to the first component.
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2023/023735
Publication Date:
February 15, 2024
Filing Date:
June 27, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H01L23/00; H05K1/14; H05K3/28; H05K9/00
Domestic Patent References:
| WO2020100849A1 | 2020-05-22 | |||
| WO2021002296A1 | 2021-01-07 | |||
| WO2016039231A1 | 2016-03-17 | |||
| WO2014097725A1 | 2014-06-26 |
Foreign References:
| JP2006514438A | 2006-04-27 | |||
| JP2011124366A | 2011-06-23 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF:
Previous Patent: SILICON CARBIDE SEMICONDUCTOR DEVICE
Next Patent: HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS
Next Patent: HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS