Title:
HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/034279
Kind Code:
A1
Abstract:
This heat dissipation device 1A comprises: a casing 100 which has a first inner surface 10a and a second inner surface 10b opposite one another in a thickness direction T and is provided with an internal space; a working medium 20 which is enclosed in the internal space in the casing 10; a wick 30 which is provided in the internal space in the casing 10; and a support member 40 which is provided in the internal space in the casing 10 and is in contact with the first inner surface 10a of the casing 10 and the wick 30 in the thickness direction T. The first inner surface 10a of the casing 10 is provided with hollows 50 located around the support member 40. In a plan view from the thickness direction T, at least some of the hollows 50 adjoin a base 41 of the support member 40 on the side of the first inner surface 10a of the casing 10.
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Inventors:
OHITSU TOSHIKATSU (JP)
Application Number:
PCT/JP2023/023790
Publication Date:
February 15, 2024
Filing Date:
June 27, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/427; F28D15/02; F28D15/04; H05K7/20
Domestic Patent References:
| WO2018198353A1 | 2018-11-01 | |||
| WO2007026833A1 | 2007-03-08 | |||
| WO2019235552A1 | 2019-12-12 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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