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Patent Searching and Data


Title:
CIRCUIT SUBSTRATE SUPPORT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/063950
Kind Code:
A1
Abstract:
A more practical circuit substrate support system is provided. While picking up and holding a substrate (36), each substrate support (160) from four substrate supporting units (154) is raised and lowered by a support raising and lowering device (164). During component mounting, if the force that presses a component against a substrate is about to increase while exceeding an allowable range, an electric motor (166) is controlled on the basis of an output value from an encoder installed on the electric motor (166) and a detection value from an ammeter measuring the current supplied to the electric motor (166), causing the four substrate supporting units (154) to have respective supporting forces controlled to a preset magnitude while the height positions thereof become equalized, such that the component (86) is mounted via an appropriate pressing force onto the horizontally laid substrate (36). Ascending and descending control of the substrate support (160) also allows for suppression of vibrations that occur when the component abuts the substrate (36). It is also possible to cause the four substrate supports (160) to support the substrate (36) in an inclined position with respect to the horizontal plane, so that component mounting is carried out while the substrate is parallel to an inclined component underside.

Inventors:
OYAMA SHIGETO (JP)
IISAKA JUN (JP)
Application Number:
PCT/JP2013/079757
Publication Date:
May 07, 2015
Filing Date:
November 01, 2013
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/04
Foreign References:
JP3128354B22001-01-29
JP2010114325A2010-05-20
JP2002359499A2002-12-13
JP2006294981A2006-10-26
JPH07183700A1995-07-21
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)
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