Title:
CO-PACKAGED ASSEMBLY AND NETWORK DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/109799
Kind Code:
A1
Abstract:
A co-packaged assembly, comprising a substrate, a chip, and a plurality of CPOs. The chip is arranged in a central region on a first side of the substrate, and the CPOs are arranged in a peripheral region of the substrate; the orthographic projections of the CPOs on the substrate fully surround the orthographic projection of the chip on the substrate, and the orthographic projections of two adjacent CPOs on the substrate are spliced with each other. The co-packaged assembly can increase an optical fiber fan-out space and improve space use efficiency, and can avoid the problem of insertion loss caused by vertical coupling; meanwhile, efficient expansion of the area of the CPOs can further be achieved.
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| JPH04100009 | OPTICAL SYSTEM FOR COUPLING OPTICAL FIBER |
Inventors:
TANG NINGFENG (CN)
Application Number:
PCT/CN2022/138596
Publication Date:
June 22, 2023
Filing Date:
December 13, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
G02B6/42; H04Q11/00
Foreign References:
| CN113764390A | 2021-12-07 | |||
| CN113227864A | 2021-08-06 | |||
| CN113759476A | 2021-12-07 | |||
| US20210048587A1 | 2021-02-18 | |||
| US20200232610A1 | 2020-07-23 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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