Title:
COMBINED SENSOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/189963
Kind Code:
A1
Abstract:
Disclosed are a combined sensor (100) and a manufacturing method therefor, and an electronic device. The combined sensor (100) comprises: a packaging body (10), the packaging body (10) comprising a substrate (12) and a cover plate (19), wherein the substrate (12) and the cover plate (19) are bonded and connected by means of a bonding structure, and an accommodating cavity (11) is formed by enclosure by the substrate and the cover plate; an environment sensor (30), the environment sensor (30) comprising an environment sensing chip (31), and a first integrated circuit chip (32) electrically connected to the environment sensing chip (31), and the environment sensing chip (31) and the first integrated circuit chip (32) both being arranged inside the accommodating cavity (11); and an acoustic sensor (40), the acoustic sensor (40) comprising a microphone chip (41) and a second integrated circuit chip (42) electrically connected to the microphone chip (41), and the microphone chip (41) and the second integrated circuit chip (42) both being arranged inside the accommodating cavity (11).
Inventors:
WANG DEXIN (CN)
QIU WENRUI (CN)
LIU BING (CN)
QIU WENRUI (CN)
LIU BING (CN)
Application Number:
PCT/CN2020/135386
Publication Date:
September 30, 2021
Filing Date:
December 10, 2020
Export Citation:
Assignee:
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD (CN)
International Classes:
G01L19/14; H04R3/00
Foreign References:
| CN111307366A | 2020-06-19 | |||
| CN211504517U | 2020-09-15 | |||
| CN210183545U | 2020-03-24 | |||
| CN109348389A | 2019-02-15 | |||
| CN106744647A | 2017-05-31 | |||
| CN109476476A | 2019-03-15 | |||
| CN106458575A | 2017-02-22 | |||
| CN207869502U | 2018-09-14 | |||
| US9809448B2 | 2017-11-07 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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