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Patent Searching and Data


Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/005667
Kind Code:
A1
Abstract:
This component mounting device is provided with a head, a nozzle, a sensor, and a control unit. The control unit is configured to perform a calibration process and a mounting process. The control unit, during the calibration process, performs a first detecting operation for detecting a signal output from the sensor when the nozzle is moved to a predetermined position relative to the sensor, and a calibration operation for calibrating the height position of the nozzle on the basis of the signal output from the sensor. During the mounting process, the control unit performs a second detecting operation for detecting a signal output from the sensor when the nozzle is moved to a predetermined position relative to the sensor, and a mounting operation for mounting a component onto a substrate. During the first detecting operation and the second detecting operation, if it is determined that there is anomaly in the output of the sensor, the control unit outputs error information indicating anomaly in the sensor.

Inventors:
MIZUNO TOSHIAKI (JP)
Application Number:
PCT/JP2019/026905
Publication Date:
January 14, 2021
Filing Date:
July 05, 2019
Export Citation:
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Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04; H05K13/00
Domestic Patent References:
WO2019003336A12019-01-03
Foreign References:
JP2017092200A2017-05-25
JP2012039302A2012-02-23
JPH03257894A1991-11-18
JP2007042987A2007-02-15
JPH11346096A1999-12-14
JP2003536252A2003-12-02
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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