COMPOSITE COPPER WIRING LINE AHD MULTILAYER BODY HAVING RESIST LAYER

Title:

COMPOSITE COPPER WIRING LINE AHD MULTILAYER BODY HAVING RESIST LAYER

Document Type and Number:

WIPO Patent Application WO/2021/193470

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide: a novel composite copper wiring line; and a multilayer body having a resist layer, said multilayer body being used for the production of a composite copper wiring line. The present invention provides a composite copper wiring line wherein a copper wiring line, which has a first surface, a second surface and a third surface, has a layer containing a first copper oxide on the first surface, while being provided with a first plating layer that contains a metal other than copper on the surface of the layer containing the first copper oxide.

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Inventors:

SATO MAKIKO (JP)
TERAKI SHIN (JP)

Application Number:

PCT/JP2021/011514

Publication Date:

September 30, 2021

Filing Date:

March 19, 2021

Export Citation:

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Assignee:

NAMICS CORP (JP)

International Classes:

G03F7/004; B32B15/08; G03F7/40; H05K1/03; H05K1/09; H05K3/06

Domestic Patent References:

WO2019093494A1

2019-05-16

Foreign References:

JP2018053327A	2018-04-05
JPH11220255A	1999-08-10