Title:
VEHICLE CONTROL DEVICE, VEHICLE CONTROL METHOD, AND VEHICLE CONTROL SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/029310
Kind Code:
A1
Abstract:
This vehicle control device comprises: a first limiting unit which limits a first driving force for a front shaft (one shaft) that is an axle connected to a driving part for generating a driving force for driving a vehicle, in order to cause vehicle wheels 21 disposed on the front shaft (one shaft) to be viscously mounted; and a torque limiting unit 32 which is a second limiting unit for limiting, at a location where the first driving force is limited, a second driving force for rear shafts (2-4 shafts) which are axles located on the rear side in the traveling direction of the vehicle from the front shaft (one shaft), in order to cause vehicle wheels 21 disposed on the rear shafts (2-4 shafts) to be viscously mounted. Accordingly, it is possible to provide a vehicle control device, a vehicle control method, and a vehicle control system with which idling slip of the vehicle wheels can be suppressed according to various road states.
More Like This:
Inventors:
KUNIHIRO NAOKI (JP)
HATSUSE WATARU (JP)
OGAWA KAZUTOSHI (JP)
HATSUSE WATARU (JP)
OGAWA KAZUTOSHI (JP)
Application Number:
PCT/JP2023/025921
Publication Date:
February 08, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B60L15/20; B60L9/18
Foreign References:
| JP2003348706A | 2003-12-05 | |||
| JP2011004549A | 2011-01-06 | |||
| JP2010028982A | 2010-02-04 |
Attorney, Agent or Firm:
SUNNEXT INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: LENS DEVICE
Next Patent: COMPOSITE MATERIAL, HEAT SPREADER, AND SEMICONDUCTOR PACKAGE
Next Patent: COMPOSITE MATERIAL, HEAT SPREADER, AND SEMICONDUCTOR PACKAGE