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Title:
COMPOUND, MOLDED ARTICLE, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2020/246246
Kind Code:
A1
Abstract:
The compound includes a metal powder, an epoxy resin, and a wax. The content of metal powder is from 96 mass% to less than 100 mass%. The wax includes at least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters.

Inventors:
INOUE HIDETOSHI (JP)
ONO YUTA (JP)
ENDO YOSHINORI (JP)
Application Number:
PCT/JP2020/019981
Publication Date:
December 10, 2020
Filing Date:
May 20, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08K5/098; C08K3/08; C08L63/00
Domestic Patent References:
WO2019229961A12019-12-05
WO2019106813A12019-06-06
WO2019229960A12019-12-05
Foreign References:
JPS60220908A1985-11-05
JP2019048948A2019-03-28
JPH0982511A1997-03-28
JP2002260909A2002-09-13
JP2018041872A2018-03-15
JPH07309998A1995-11-28
JP2014013803A2014-01-23
Other References:
See also references of EP 3960801A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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