Title:
CONNECTED SUBSTRATE, METHOD OF MANUFACTURING THEREOF, ELEMENT SUBSTRATE, AND LIGHT-EMITTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2012/086724
Kind Code:
A1
Abstract:
Provided is a connected substrate that has excellent partitioning precision, said substrate reducing the occurrence of burrs and splinters on element substrates after partitioning, and enabling the prevention of the permeating of sealing materials on mounting surfaces. In the connected substrate (1), a plurality of element substrates (3) are formed in a mother board (2) comprising an inorganic insulation material, said element substrates (3) being partitioned by longitudinal and lateral partitioning grooves (5). Each of the element substrates (3) comprises an encapsulation area (22) in a portion of which a light-emitting element is mounted, and the entire light-emitting element is encapsulated with a sealing material. The surface roughness (Ra) of peripheral areas in contact with the sealing area (22) is not more than 0.15 μm, and the surface roughness (Ra) of the inner surfaces (51) of the partitioning grooves (5) is 0.15-0.5 μm.
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Inventors:
NAKAGAWA KOJI (JP)
Application Number:
PCT/JP2011/079722
Publication Date:
June 28, 2012
Filing Date:
December 21, 2011
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
NAKAGAWA KOJI (JP)
NAKAGAWA KOJI (JP)
International Classes:
H01L33/48; H01L23/12
Foreign References:
| JP2005191065A | 2005-07-14 | |||
| JP2007266647A | 2007-10-11 | |||
| JP3266490B2 | 2002-03-18 | |||
| JP3420469B2 | 2003-06-23 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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Claims:
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