Title:
CONNECTION METHOD FOR ULTRASONIC PROBE AND SIGNAL LINE
Document Type and Number:
WIPO Patent Application WO/2013/145415
Kind Code:
A1
Abstract:
A plurality of connection conductors (61) are shielded from each other as a result of: the plurality of connection conductors (61) being formed on a printed wiring board (6) and connecting between each of a plurality of lead signal lines (24) drawn out from a plurality of piezoelectric elements (2) and each of a plurality of communications cables connected to an ultrasonic diagnostic device main body; and a ground conductive layer (64) for connection conductors being formed, via an insulating layer (63) for connection conductors, on the printed wiring board (6) so as to cover the outer perimeter of each of the plurality of connection conductors (61).
Inventors:
OSAWA ATSUSHI (JP)
Application Number:
PCT/JP2012/079248
Publication Date:
October 03, 2013
Filing Date:
November 12, 2012
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
A61B8/00; H04R17/00
Foreign References:
| JP2007189342A | 2007-07-26 | |||
| JP2005340903A | 2005-12-08 | |||
| JPH11243594A | 1999-09-07 | |||
| JPH10285695A | 1998-10-23 | |||
| JPH06105396A | 1994-04-15 | |||
| JPH06105396A | 1994-04-15 |
Other References:
See also references of EP 2832294A4
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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