Title:
COOLER AND COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004655
Kind Code:
A1
Abstract:
This cooler comprises: a housing that includes an opening, an inner space section, and a bottom section; and a partition wall that extends up from the bottom section in a first direction and is accommodated in the inner space section. The housing is provided with an inflow passage and an outflow passage each connected to the inner space section. The inner space section includes a first storage section and a second storage section demarcated by the partition wall. The first storage section is connected to the inflow passage. The second storage section is connected to the outflow passage. The partition wall includes an overflow section that overlaps the opening section when viewed in the first direction and is the most distant section from the base section. The overflow section is positioned between the bottom section and the opening.
Inventors:
YASUNISHI TOMOHIRO (JP)
Application Number:
PCT/JP2023/022097
Publication Date:
January 04, 2024
Filing Date:
June 14, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| WO2008007799A1 | 2008-01-17 |
Foreign References:
| JP2011258655A | 2011-12-22 | |||
| JP2006019676A | 2006-01-19 | |||
| JP2017174991A | 2017-09-28 | |||
| JPH1022428A | 1998-01-23 | |||
| JP2001284513A | 2001-10-12 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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