Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/181345
Kind Code:
A1
Abstract:
This cooling device comprises a support plate and a plurality of heat pipes opposite thereto in an up-down direction. The heat pipes are disposed on the upper side of the support plate in the up-down direction. The heat pipes extend in a first direction orthogonal to the up-down direction, and are arrayed in a second direction orthogonal to the up-down direction and the first direction. The support plate has protrusions protruding in the up-down direction. The protrusions are disposed between heat pipes adjacent to each other in the second direction. The width of the heat pipes in the up-down direction is smaller than the width of the heat pipes in the second direction. The width of at least one of the protrusions in the second direction is smaller than the width of the heat pipes in the up-down direction.
Inventors:
NISHIKAWA KAZUHIRO (JP)
HANANO MASAAKI (JP)
HANANO MASAAKI (JP)
Application Number:
PCT/JP2022/005183
Publication Date:
September 01, 2022
Filing Date:
February 09, 2022
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Domestic Patent References:
| WO2021241161A1 | 2021-12-02 |
Foreign References:
| US20180168069A1 | 2018-06-14 | |||
| JP3150877U | 2009-06-04 | |||
| JP3170213U | ||||
| JP3138847U | 2008-01-24 | |||
| JP2009198173A | 2009-09-03 | |||
| JP2006032798A | 2006-02-02 |
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