Title:
METHOD FOR PRODUCING FILM WIRE
Document Type and Number:
WIPO Patent Application WO/2023/145440
Kind Code:
A1
Abstract:
The present invention provides a method for producing a novel electrical wiring line which is suited to the demands for weight saving and space saving, and which can be produced at a low cost. A method for producing a film wire, wherein an electrical wiring line is obtained by separating a film, which comprises a base film that is formed of an insulating resin, a conductive layer that is formed on the upper surface of the base film and a cover layer that is formed on the upper surface of the conductive layer, into a predetermined shape. It is preferable that: the conductive layer and the cover layer are formed by a sputtering method; the conductive layer has an electrical resistivity of 10 µΩcm or less, while being mainly composed of any one of Al, Cu and Ag; and the cover layer is a non-magnetic alloy film that is mainly composed of any one of Ti, Cr, Mo and Ni.
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Inventors:
MURATA HIDEO (JP)
Application Number:
PCT/JP2023/000515
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
PROTERIAL LTD (JP)
International Classes:
H01B13/00; C23C14/12; H01B5/14; H05K1/09
Foreign References:
| JP2001338539A | 2001-12-07 | |||
| JP2017066519A | 2017-04-06 |
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