Title:
CU-BASED ALLOY POWDER HAVING EXCELLENT ELECTRIC CONDUCTIVITY
Document Type and Number:
WIPO Patent Application WO/2023/162610
Kind Code:
A1
Abstract:
Provided is a Cu-based alloy powder, which is suitable for molding that is based on a process involving rapid melting and rapid solidification and with which a Cu-based alloy molded article having excellent relative density, electric conductivity, and strength can be formed. This Cu-based alloy powder comprises 0.05 to 10.0% by mass of an additive element M1 component, 0.01 to 1.00% by mass of a third element M2 component, and the balance Cu with unavoidable impurities. The M1 component comprises any one or more of Nd, Zr, Mo, and Cr, and the M2 component comprises one or more elements having a solid solubility limit of not more than 1.0% by mass relative to the M1 component added to the alloy powder.
More Like This:
Inventors:
SAKATA MASAHIRO (JP)
IKEDA HIROKI (JP)
SAWADA TOSHIYUKI (JP)
IKEDA HIROKI (JP)
SAWADA TOSHIYUKI (JP)
Application Number:
PCT/JP2023/003297
Publication Date:
August 31, 2023
Filing Date:
February 01, 2023
Export Citation:
Assignee:
SANYO SPECIAL STEEL CO LTD (JP)
International Classes:
B22F1/00; B22F3/105; B22F10/28; B22F10/34; B33Y70/00; B33Y80/00; C22C9/00; B22F10/64
Domestic Patent References:
| WO2019239655A1 | 2019-12-19 |
Foreign References:
| JP2021017639A | 2021-02-15 | |||
| JP2022160961A | 2022-10-20 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Download PDF: