CURABLE COMPOSITION CONTAINING POLYPHENYLENE ETHER; DRY FILM; PREPREG; CURED PRODUCT; LAMINATE PLATE; AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2021/065964

A1

A curable composition is provided which, while maintaining low dielectric properties, is soluble in various solvents (organic solvents that do not have high toxicity, for example, cyclohexanone) and has excellent mechanical properties when cured to obtain a film. The provided curable composition is characterized by containing: polyphenylene ether which is obtained from raw material phenols including phenols that satisfy at least condition 1 (having a hydrogen atom in the ortho position and the para position), which has a slope, calculated in a conformation plot, of less than 0.6, and which contains a functional group that contains an unsaturated carbon bond; and at least one item selected from a compound that contains at least one maleimide group in one molecule, a triazine compound that contains at least one thiol group, and cross-linked polystyrene particles.

WO/2021/099439	PEO-PPO-PEO TRIBLOCKCOPOLYMERS AS ADDITIVES FOR EPOXIDE-ANHYDRIDE SYSTEMS
JP3136869	MATERIAL WITH SANDWICH STRUCTURE
JPS586622	[Title of the Invention] Funense-Tojiyou Kenichiyouzai

NOSAKA MAMI (JP)
MATSUMURA SATOKO (JP)
ISHIKAWA NOBUHIRO (JP)

PCT/JP2020/037037

April 08, 2021

September 29, 2020

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TAIYO HOLDINGS CO LTD (JP)

B32B5/00; B32B5/28; B32B15/08; B32B27/00; C08J5/24; C08K5/3415; C08K5/3477; C08K5/378; C08L25/06; C08L25/08; C08L35/00; C08L71/12; H05K1/03

WO2017094621A1

2017-06-08

JP2015120891A	2015-07-02
JP2004339342A	2004-12-02
JPH04234430A	1992-08-24
JP2003160662A	2003-06-03
JP2014101398A	2014-06-05
JP2017206578A	2017-11-24
JP2015168767A	2015-09-28
JP2020147735A	2020-09-17

ITOH, Atsushi (JP)

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