Title:
CURABLE COMPOSITION AND USE OF SAME
Document Type and Number:
WIPO Patent Application WO/2023/162664
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable composition having excellent workability and exceptional adhesiveness even after alkali treatment without using an epoxy resin. The above problem is solved by providing a curable composition containing: (A) 100 parts by weight of an organic polymer having a hydrolyzable silyl group; (B) 3-35 parts by weight of at least one selected from the group consisting of paraffinic process oils, naphthenic process oils, and aromatic process oils; (C) 20-200 parts by weight of silica sand; and (D) 2-10 parts by weight of a silane compound having an epoxy group and/or a silane compound having an amino group.
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Inventors:
OGAWA AKIRA (JP)
SAKABE MASAOMI (JP)
YANO AYAKO (JP)
SAKABE MASAOMI (JP)
YANO AYAKO (JP)
Application Number:
PCT/JP2023/003898
Publication Date:
August 31, 2023
Filing Date:
February 07, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08K3/26; C08L101/10; C08K3/34; C08K5/5435; C08L91/00; C09J11/04; C09J11/06; C09J171/02; C09J201/10
Domestic Patent References:
| WO2006046472A1 | 2006-05-04 | |||
| WO2006046473A1 | 2006-05-04 |
Foreign References:
| JP2017089258A | 2017-05-25 | |||
| JP2013032675A | 2013-02-14 | |||
| JP2005054174A | 2005-03-03 | |||
| JP2016098302A | 2016-05-30 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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