Title:
POLYFUNCTIONAL COMPOUND, COMPOSITION, ADHESIVE COMPOSITION, ADHESIVE COMPOSITION SET, ADHESION METHOD, AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/210587
Kind Code:
A1
Abstract:
A polyfunctional compound represented by formula (1). (In the formula, X represents a carbon atom or a C1-20 n-valent linking group, Ar represents an arylene group, R1 each independently represent a divalent group including a polymer block, R2 each independently represent a glycidyl group, a phenol group, a hydroxyl group, a carboxyl group, an amino group, a thiol group, a cyano group, a nitro group, or an acid anhydride group, and n represents an integer of 3-8.)
Inventors:
TAKAHASHI YUSUKE (JP)
KURIMURA HIROYUKI (JP)
YAMASHITA YUKIHIKO (JP)
KURIMURA HIROYUKI (JP)
YAMASHITA YUKIHIKO (JP)
Application Number:
PCT/JP2021/015356
Publication Date:
October 21, 2021
Filing Date:
April 13, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J11/06; C08G59/30; C09J183/04; C09J201/00
Foreign References:
| JP2016084295A | 2016-05-19 | |||
| JP2015199804A | 2015-11-12 | |||
| JP2003040998A | 2003-02-13 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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