Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/090317
Kind Code:
A1
Abstract:
The present invention provides a curable resin composition that yields a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by curing the curable resin composition or the sealing material. The present invention further provides a camera module that includes the cured product.
Inventors:
NAGATA RIEKO (JP)
Application Number:
PCT/JP2022/042374
Publication Date:
May 25, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/62; C08G59/56; C08K3/013; C08L63/00; G02B7/02
Domestic Patent References:
| WO2008032704A1 | 2008-03-20 | |||
| WO2013080732A1 | 2013-06-06 | |||
| WO2022210261A1 | 2022-10-06 |
Foreign References:
| CN111675818A | 2020-09-18 | |||
| JP2016021033A | 2016-02-04 | |||
| JP2012247518A | 2012-12-13 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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