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Title:
LAYERING/MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/095454
Kind Code:
A1
Abstract:
A layering/molding device (100): executes additive processing in which a melted processing material (7) is layered at a processing position while the processing position is moved on a workpiece (3); and forms a molded object (4) by repeating the additive processing. The layering/molding device (100) is characterized by being provided with: a height measuring unit that outputs measurement results indicating the height, at a measuring position, of the molded object (4) which has been formed on the workpiece (3); and a control unit (10) that controls, in accordance with the measurement results, processing conditions for when new layering is to be carried out at the measuring position.

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Inventors:
TAKUSHIMA SHIGERU (JP)
KAWANO HIROYUKI (JP)
SAWA YOSHITSUGU (JP)
MORITA DAIJI (JP)
Application Number:
PCT/JP2018/041751
Publication Date:
May 14, 2020
Filing Date:
November 09, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B22F3/16; B22F3/105; B23K26/34; B29C64/118; B29C64/393; B33Y30/00
Domestic Patent References:
WO2018147296A12018-08-16
WO2018053299A12018-03-22
Foreign References:
JP2009083326A2009-04-23
JP2017160471A2017-09-14
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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