Title:
DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/018769
Kind Code:
A1
Abstract:
This dicing method of a bonded wafer in which a first board and a second board are bonded together, a space being formed between the first board and the second board, and a terminal for electrically connecting to an exterior being formed in the space, comprises: a pasting step in which a tape is pasted onto the first board; an irradiation step in which a laser is irradiated onto a portion of the first board which coincides with the space when viewed in the direction orthogonal to the first board; an irradiation step in which a laser is irradiated onto a portion of the second board which coincides with the space when viewed in the direction orthogonal to the first board; and a division step in which the wafer is divided into a plurality of pieces with the laser-irradiated positions in the irradiation steps as starting points by expanding the tape.
More Like This:
| WO/2003/071591 | METHOD FOR DIVIDING SEMICONDUCTOR WAFER |
| JP2011108708 | METHOD OF PROCESSING WAFER |
| JP2023154134 | PROCESSING DEVICE |
Inventors:
YASUKAWA TETSURO (JP)
SHIBATA TAKESHI (JP)
SHIBATA TAKESHI (JP)
Application Number:
PCT/JP2023/021053
Publication Date:
January 25, 2024
Filing Date:
June 06, 2023
Export Citation:
Assignee:
CANON KK (JP)
International Classes:
H01L21/301; B41J2/16
Foreign References:
| JP2008194719A | 2008-08-28 | |||
| JP2010167634A | 2010-08-05 | |||
| JP2021146696A | 2021-09-27 | |||
| JP2004358842A | 2004-12-24 | |||
| JP2013156102A | 2013-08-15 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
Download PDF: