DIEPOXY COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MEMBER

Title:

DIEPOXY COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MEMBER

Document Type and Number:

WIPO Patent Application WO/2023/145580

Kind Code:

A1

Abstract:

The present invention provides: a diepoxy compound from which a cured product having a sufficiently low water absorption rate and excellent flexibility is obtained; a curable composition using said diepoxy compound; a cured product; and an optical member.　One aspect of the present invention pertains to a diepoxy compound represented by formula 1 and a diepoxy compound represented by formula 2.

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Inventors:

TAKAHASHI MARIA (JP)

Application Number:

PCT/JP2023/001404

Publication Date:

August 03, 2023

Filing Date:

January 18, 2023

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Assignee:

AGC INC (JP)

International Classes:

C08G59/24

Domestic Patent References:

WO2022131132A1

2022-06-23

Foreign References:

CN102250316A	2011-11-23
JP2009062449A	2009-03-26
JP2017179090A	2017-10-05

Attorney, Agent or Firm:

SHIGA INTERNATIONAL PATENT OFFICE (JP)

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