Title:
DRY CUTTING APPARATUS AND CUTTING METHOD FOR WALL OR SLAB
Document Type and Number:
WIPO Patent Application WO/2023/243954
Kind Code:
A1
Abstract:
A dry cutting apparatus of the present invention comprises: a wire saw device which rotates a cutting wire installed to pass through two holes drilled in a structure; a roller jig mounted on one side surface of the structure so as to guide and support the cutting wire; a cover member coupled to one side surface of the structure so as to cover and seal a cut area; an air gun which sprays compressed air onto the cut area in the direction of the cover member; and a dust collection device which is connected to one side of the cover member by means of a dust collection hose so as to collect foreign substances.
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Inventors:
LEE SUNG JUN (KR)
LEE CHAE MUN (KR)
LEE CHAE MUN (KR)
Application Number:
PCT/KR2023/007997
Publication Date:
December 21, 2023
Filing Date:
June 12, 2023
Export Citation:
Assignee:
EGUN CO LTD (KR)
International Classes:
B28D1/08; B28D7/02
Foreign References:
KR100898151B1 | 2009-05-19 | |||
KR102286165B1 | 2021-08-05 | |||
JP2018145797A | 2018-09-20 | |||
JP6987283B1 | 2021-12-22 | |||
US7150277B1 | 2006-12-19 | |||
KR102496000B1 | 2023-02-06 |
Attorney, Agent or Firm:
PARK, Jeong Hwan (KR)
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