Title:
ELECTROMAGNETIC SHIELDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/123864
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic shielding material which is a multilayer body that is composed of a metal layer and an insulating layer, wherein the occurrence of a cracking in the metal layer due to a shaping process is suppressed, while improving the electromagnetic shielding effect. An electromagnetic shielding material which is a multilayer body that is obtained by alternately stacking N (N is an integer of 1 or more) shielding metal layers and (N + 1) insulating layers, with an adhesive layer being interposed therebetween, and which is additionally provided with a metal layer for earth connection as an outermost layer of the multilayer body. With respect to this electromagnetic shielding material, only one surface of the metal layer for earth connection is superposed on the insulating layer, with the adhesive layer being interposed therebetween, and if d1 is the thickness of the adhesive layer on the one surface, ε1 is the Young's modulus of the adhesive layer on the one surface, d2 is the thickness of the metal layer for earth connection, ε2 is the Young's modulus of the metal layer for earth connection, and ε3 is the composite Young's modulus of the adhesive layer on the one surface and the metal layer for earth connection, the relational expression described below is satisfied. ε3/ε2 > 0.60 (ε3 = ε1(d1/(d1 + d2)) + ε2(d2/(d1 + d2)))
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Inventors:
YAMAMOTO YUKITO (JP)
Application Number:
PCT/JP2021/035726
Publication Date:
June 16, 2022
Filing Date:
September 28, 2021
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
H05K9/00; B32B7/025
Foreign References:
JP2018171741A | 2018-11-08 | |||
JP2003285002A | 2003-10-07 | |||
JPH07290449A | 1995-11-07 | |||
JP4602680B2 | 2010-12-22 | |||
JP2008021979A | 2008-01-31 | |||
JP6278922B2 | 2018-02-14 | |||
JP2010278119A | 2010-12-09 | |||
JP2012053234A | 2012-03-15 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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