Title:
ELECTROMAGNETIC WAVE SHIELDING FILM
Document Type and Number:
WIPO Patent Application WO/2021/131244
Kind Code:
A1
Abstract:
Provided is an electromagnetic wave shielding film which exhibits excellent folding resistance, and excellent connection stability to a printed circuit board when adhered to a printed circuit board and/or adhesion between a protective layer and a bonding film. An electromagnetic wave shielding film 1 equipped with an adhesive layer 11 and a protective layer 12 layered on the adhesive layer 11, wherein the protective layer 12 contains a thermosetting component, a rubber polymer and a fatty acid.
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Inventors:
AOYAGI YOSHIHIKO (JP)
KAMINO KENJI (JP)
KAMINO KENJI (JP)
Application Number:
PCT/JP2020/038646
Publication Date:
July 01, 2021
Filing Date:
October 13, 2020
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
B32B27/18; B32B25/08; H05K9/00
Domestic Patent References:
| WO2018084235A1 | 2018-05-11 |
Foreign References:
| JP2002080725A | 2002-03-19 | |||
| JP2013201359A | 2013-10-03 | |||
| JP2001036285A | 2001-02-09 | |||
| JPS6151060A | 1986-03-13 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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