ELECTRONIC CIRCUIT DEVICE - FURUKAWA ELECTRIC CO LTD

Title:

ELECTRONIC CIRCUIT DEVICE

Document Type and Number:

WIPO Patent Application WO/2015/104954

Kind Code:

A1

Abstract:

The purpose of the present invention is to improve the heat dissipation effect of a conductor layer while suppressing breakage of a substrate along the boundary plane between an insulating layer and the conductor layer. An electronic circuit device (100) comprises an insulating layer (1), a conductor layer (2) formed on at least one side of the insulating layer (1), and a heating element (4) disposed on the side of the conductor layer (2) opposite from the insulating layer (1) with a joining layer (3) interposed therebetween. The conductor layer (2) comprises a heat dissipating conductor layer (21) located on the heating element (4) side and a circuit layer (22) located on the insulating layer (1) side. On the boundary plane between the heat dissipating conductor layer (21) and the circuit layer (22), the shortest distance (l1) from the side edge section of the heating element (4) to the side edge section of the heat dissipating conductor layer (21) is equal to or greater than the thickness (t1) of the heat dissipating conductor layer (21).

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Inventors:

KOJIMA NAOYUKI (JP)
SATO SHUNICHIRO (JP)
HIKASA KAZUHITO (JP)
FUJIWARA HIDEMICHI (JP)

Application Number:

PCT/JP2014/083083

Publication Date:

July 16, 2015

Filing Date:

December 15, 2014

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)

International Classes:

H01L23/12; H01L23/36; H05K1/02

Foreign References:

JP2012531728A	2012-12-10
JP2010103311A	2010-05-06
JPH10125821A	1998-05-15
JP2006202938A	2006-08-03
JP2006319146A	2006-11-24
JPH104156A	1998-01-06
JP2004014589A	2004-01-15
JPH0551271A	1993-03-02
JP2003188316A	2003-07-04

Other References: