Title:
ELECTRONIC COMPONENT MOUNTING MODULE HAVING BUS BAR STACK, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/085439
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide, for example: an electronic component mounting module of surface mount type using bus bars, wherein the height of solder mount surface is aligned between an anode bus bar and a cathode bus bar that are stacked, thereby enabling the use of reflow soldering; and an electronic component mounting module achieving more space savings and reduction in size without degrading electric characteristics. This electronic component mounting module comprises a bus bar stack in which a first bus bar and a second bus bar each comprising a region for soldering an external terminal of an electronic component are insulated and stacked. The first bus bar comprises an opening. The second bus bar comprises a protrusion protruding on the first bus bar side and including a soldering region. The protrusion of the second bus bar is disposed in a position corresponding to the opening. A soldering region of the first bus bar and the soldering region of the protrusion are disposed at a corresponding height such that the external terminal of the electronic component can be soldered by reflow soldering. The electronic component mounting module comprises a plurality of electronic components with external terminals soldered on the first bus bar side. The plurality of electronic components have the external terminals of the same polarity each connected to one protrusion.
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Inventors:
IDEUE TAKASHI (JP)
KUROSU MITSURU (JP)
KUROSU MITSURU (JP)
Application Number:
PCT/JP2022/042458
Publication Date:
May 19, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
NIPPON CHEMICON (JP)
International Classes:
H01G13/00; H01G2/02; H01G4/228; H01G4/38
Foreign References:
| JP2019212747A | 2019-12-12 | |||
| JP2015015380A | 2015-01-22 | |||
| JP2012044097A | 2012-03-01 | |||
| JP2001178151A | 2001-06-29 |
Attorney, Agent or Firm:
HAMADA Haruo (JP)
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