Title:
ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262636
Kind Code:
A1
Abstract:
This electronic element mounting package is provided with: a substrate including a base portion having a first surface, and a protruding portion protruding from the first surface and having a second surface; a wiring substrate positioned on the second surface; and a lid body covering the protruding portion and the wiring substrate. An outer surface of the protruding portion other than the second surface has a shape without a ridge line, or a shape of which two surfaces forming an arbitrary ridge line form an obtuse angle.
Inventors:
KITAHARA HIKARU (JP)
Application Number:
PCT/JP2020/025307
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/04; H01L23/06; H01L23/12; H01L31/02; H01S5/022
Domestic Patent References:
| WO2007099612A1 | 2007-09-07 |
Foreign References:
| JP2019046830A | 2019-03-22 | |||
| JP2005064484A | 2005-03-10 | |||
| JP2015082609A | 2015-04-27 | |||
| JP2006351610A | 2006-12-28 | |||
| JPH0213759U | 1990-01-29 | |||
| JPS5925292A | 1984-02-09 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
Download PDF: