Title:
ELECTRONIC COMPONENT TESTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/188844
Kind Code:
A1
Abstract:
Provided is an electronic component testing device whereby heating or cooling of an electronic component is performed in a short time, and temperature adjustment can also be easily performed. A testing device 1 is provided with: a conduit 37 through which cooling water flows; a hollow head part 39 which is communicated with the conduit 37 and which performs cooling through use of the cooling water; and a plurality of thermoelectric elements 41, back surfaces 41b of which are attached to the head part 39, and front surfaces 41a of which are brought into contact with a plurality of IC chips C; the plurality of thermoelectric elements 41 being configured so that when the front surfaces 41a or the back surfaces 41b thereof serve as heating surfaces, the other of the front surfaces 41a and the back surfaces 41b serve as cooling surfaces, and the thermoelectric elements 41 heat or cool the IC chips C.
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Inventors:
KIMURA YOICHI (JP)
Application Number:
PCT/JP2019/029904
Publication Date:
September 24, 2020
Filing Date:
July 30, 2019
Export Citation:
Assignee:
NEO CORP (JP)
International Classes:
G01R31/26
Domestic Patent References:
| WO2009157037A1 | 2009-12-30 |
Foreign References:
| JPH0372376U | 1991-07-22 | |||
| JP2001237284A | 2001-08-31 | |||
| JP2013130423A | 2013-07-04 | |||
| JP2017173030A | 2017-09-28 | |||
| JP2007163193A | 2007-06-28 | |||
| JP2008275512A | 2008-11-13 | |||
| US20140103947A1 | 2014-04-17 |
Attorney, Agent or Firm:
SUDO Yuichi et al. (JP)
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