Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/100506
Kind Code:
A1
Abstract:
This electronic component (100) comprises: a substrate (110); a functional element (120) formed on the substrate (110); a support body (140); a cover part (150); and a protective layer (160) that covers the cover part (150). The support body (140) is disposed on the substrate (110) and around a region in which the functional element (120) is formed. The cover part (150) is disposed facing the substrate (110) and is supported by the support body (140). A hollow space (190) is formed by the substrate (110), the support body (140), and the cover part (150). The functional element (120) is formed inside the hollow space (190). In the support body (140), when the surface opposite to the substrate (110)-side surface is a first surface (141), a portion of the protective layer (160) is in contact with the first surface (141) of the support body (140) without the cover part (150) therebetween.
Inventors:
INOUE KAZUNORI (JP)
OTSUKA SHINTARO (JP)
KAWASAKI KOICHIRO (JP)
NAKANISHI HIDEFUMI (JP)
ATARASHI MASAKAZU (JP)
FUKUSHIMA MASAHIRO (JP)
OTSUKA SHINTARO (JP)
KAWASAKI KOICHIRO (JP)
NAKANISHI HIDEFUMI (JP)
ATARASHI MASAKAZU (JP)
FUKUSHIMA MASAHIRO (JP)
Application Number:
PCT/JP2020/041647
Publication Date:
May 27, 2021
Filing Date:
November 09, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H01L23/08; H03H9/25
Domestic Patent References:
| WO2018143045A1 | 2018-08-09 | |||
| WO2010114115A1 | 2010-10-07 |
Foreign References:
| JP2010200198A | 2010-09-09 | |||
| JP2005033689A | 2005-02-03 | |||
| JP2011049354A | 2011-03-10 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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