ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

WIPO Patent Application WO/2017/013839

A1

This electronic device is provided with: a circuit board (10) having two lands (11) which are parts of wiring; a mounting component (20), which is mounted on the circuit board (10), and which has two electrodes (22) respectively facing the lands (11); and two solder sections (30), which bond the lands (11) and electrode (22) portions which the lands (11) face. In a region where the circuit board (10) and the mounting component (20) face each other, a facing space (50), which is sandwiched between the two solder sections, and is opened at both ends, is formed. The facing space (50) includes a narrow portion having an opening area that is smaller than the opening area at both the ends of the facing space.

WO2001058639	SOLDER PASTE, SOLDERING METHOD USING SAID SOLDER PASTE AND JOINTED PRODUCT PREPARED BY SAID SOLDERING METHOD
JPH0654223	INDUSTRIAL APPLICABILITY: A soldering inspection device for a printed wiring board and an inspection method thereof.
JP3495601	PRINTED WIRING BOARD

OKA KENGO (JP)
ITOU SYUICHI (JP)

PCT/JP2016/003110

January 26, 2017

June 29, 2016

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DENSO CORP (JP)

H05K3/34; H05K1/18

JP2012199269A	2012-10-18
JP2003046216A	2003-02-14
JP2014204027A	2014-10-27

KIN, Junhi (JP)

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