Title:
HEAT ABSORBING ELEMENT, SEMICONDUCTOR DEVICE PROVIDED WITH SAME, AND METHOD FOR MANUFACTURING HEAT ABSORBING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/013838
Kind Code:
A1
Abstract:
A thin-film-like Peltier heat absorbing element section 20 is thermally connected to the front surface of a semiconductor element main body section 10 via a heat conductive layer 15, i.e., an electric insulator. A substance constituting the heat absorbing element 20 has, in bulk, a heat conductivity equal to or higher than 50 W/mK, and a Seebeck coefficient equal to or higher than 300 μV/K.
Inventors:
KUROKI SHINICHIRO (JP)
FURUBAYASHI YUTAKA (JP)
TANEHIRA TAKAFUMI (JP)
SEO NOBUHIDE (JP)
YONEMORI KEI (JP)
FURUBAYASHI YUTAKA (JP)
TANEHIRA TAKAFUMI (JP)
SEO NOBUHIDE (JP)
YONEMORI KEI (JP)
Application Number:
PCT/JP2016/003103
Publication Date:
January 26, 2017
Filing Date:
June 28, 2016
Export Citation:
Assignee:
MAZDA MOTOR (JP)
International Classes:
H01L35/32; H01L35/14; H01L35/22; H01L35/30; H01L35/34
Foreign References:
| JP2003243731A | 2003-08-29 | |||
| US20100176506A1 | 2010-07-15 | |||
| JP2005303082A | 2005-10-27 | |||
| JP2009194309A | 2009-08-27 | |||
| JP2006032453A | 2006-02-02 | |||
| JP2015076607A | 2015-04-20 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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