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Title:
ENCAPSULATION FLUORESCENT GLUE LAYER AND MANUFACTURING METHOD THEREFOR, AND QUANTUM DOT BACKLIGHT SOURCE
Document Type and Number:
WIPO Patent Application WO/2021/168954
Kind Code:
A1
Abstract:
Provided are an encapsulation fluorescent glue layer and a manufacturing method therefor, and a quantum dot backlight source. The quantum dot backlight source comprises a substrate, a light-emitting chip and an encapsulation fluorescent glue layer, wherein the encapsulation fluorescent glue layer is used for heat transfer and heat dissipation.

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Inventors:
WEI HONGQUAN (CN)
Application Number:
PCT/CN2020/080844
Publication Date:
September 02, 2021
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
C09J183/04; C09J11/04; C09J11/06; C09J133/04; C09J163/00; H01L33/50; H01L33/54
Foreign References:
TW201409774A2014-03-01
CN105374922A2016-03-02
CN106189249A2016-12-07
CN105679921A2016-06-15
CN108579787A2018-09-28
US20170250332A12017-08-31
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
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