Title:
SEALING MATERIAL COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120738
Kind Code:
A1
Abstract:
This sealing material composition comprises an epoxy resin, a curing agent, an inorganic filler material, and a silicone compound. In results of 1H NMR measurement carried out in CDCl3, when the chemical shift integral value of the silicone compound at -0.3-0.3 ppm is set to 300, the chemical shift integral value of the silicone compound at 3.0-4.0 ppm is 350 or less.
Inventors:
UCHIYAMA CHIKA (JP)
SHIRAGAMI MASASHI (JP)
FUSUMADA MITSUAKI (JP)
NEGORO SHUHEI (JP)
TANAKA MIKA (JP)
SUKEGAWA YUTA (JP)
KANG DONGCHUL (JP)
OSHITA TSUYOSHI (JP)
SHIRAGAMI MASASHI (JP)
FUSUMADA MITSUAKI (JP)
NEGORO SHUHEI (JP)
TANAKA MIKA (JP)
SUKEGAWA YUTA (JP)
KANG DONGCHUL (JP)
OSHITA TSUYOSHI (JP)
Application Number:
PCT/JP2022/048050
Publication Date:
June 29, 2023
Filing Date:
December 26, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09K3/10; C08G59/40; C08L63/00
Domestic Patent References:
| WO2019189142A1 | 2019-10-03 | |||
| WO2015019407A1 | 2015-02-12 |
Foreign References:
| JPH01266140A | 1989-10-24 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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