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Title:
EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/270536
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an epoxy-based material for obtaining a cured product for which the elastic modulus has been reduced in order to maintain reliability of the cured product even for situations in which environmental changes are great.　The present invention is an epoxy resin material including: (A) an epoxy compound A represented by general formula (1); (B) a phenylglycidyl ether substituted by a hydrocarbon group having 6-20 carbon atoms; and (C) a curing agent. In general formula (1), R1 and R2 each independently represent an alkylene group having 2-4 carbon atoms, R3 represents a methylene group or -C(CH3)2-, and a and b each independently represent a number 1-10.

Inventors:
SUZUKI SHO (JP)
OKANO IPPEI (JP)
TAMASO KEN-ICHI (JP)
Application Number:
PCT/JP2022/024870
Publication Date:
December 29, 2022
Filing Date:
June 22, 2022
Export Citation:
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Assignee:
ADEKA CORP (JP)
International Classes:
C08G59/24
Domestic Patent References:
WO2017099055A12017-06-15
Foreign References:
JP2017110169A2017-06-22
JP2019504903A2019-02-21
US5683627A1997-11-04
JP2016210922A2016-12-15
JPH066620B21994-01-26
JP3837134B22006-10-25
JPH0641215A1994-02-15
JPH0665310A1994-03-08
JPH06206862A1994-07-26
JPH06247925A1994-09-06
JP2699188B21998-01-19
JP2706833B21998-01-28
JP2709625B21998-02-04
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JP2782106B21998-07-30
JP2006282633A2006-10-19
JP2007091702A2007-04-12
JPH075708B21995-01-25
JP4405741B22010-01-27
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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